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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® By Erdogan Madenci, Ibrahim Guven, Bahattin Kilic (auth.)
2003 | 185 Pages | ISBN: 1461349893 | PDF | 8 MB

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

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